home contact us my fairchild home > SG6841SZ product folder > customer qualification report SG6841SZ highly-integrated green-mode pwm controller ? moisture sensitivity: 2 ? thermal impedance: 141 ? physical dimensions: soic ? esd hbm: 3 ? esd mm: 250 test standards: attribute value uom general information device marking(top mark) SG6841SZ k&60&4&z family code 0gd package type soic package description 008, plastic molded, soic-8 pkg, narrow body, smd (s1) pin count 8 maximum reflow temperature 260c restriction of hazardous substance standard plating finish matte sn base metal/leadframe material copper,iron,zinc,phosphorus,silver lead pitch 1270 minimum lead spacing 760 die fabrication fabrication process identifier sg6841c package assembly* plating finish layer thickness 8.0um - 13um thermal impedance (theta ja) 141 c/watt moisture sensitivity 2 electrical test esd human body model (hbm) 3 v esd machine model (mm) 250 v *if an attribute is listed twice, either can be used on the part. products | applications | design support | about fairchild investor relations | careers | contact us | site map | rss privacy policy | site terms & conditions | standard terms & conditions of sale ? copyright 2011 fairchild semiconductor. all rights reserved. part #, keyword, cross-reference print email favorite more... qualification data
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